Type | MPA 2-methyl-3-butyn-2-amin 2978-58-7 |
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MPA, used as nickel electroplating chemicals, nickel electroplating intermediates, nickel electroplating additives; nickel plating chemicals, nickel plating intermediates, nickel plating additives,nickel electroplating brighteners,nickel plating brighteners. |
Type | THIOFLAVIN T 2390-54-7 |
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Usage:Acid copper leveling agent,dispersing agent,to improve the throwing power and eliminate the fogging phenomenon in LCD.THIOFLAVINE T,used as copper electroplating chemicals,copper electroplating intermediates, copper electroplating additives;copper plating chemicals,copper plating intermediates,copper plating additives.Copper electroplating brighteners, copper plating brighteners. |
Type | SPS bis-(3-Sulfopropyl)disulfide 27206-35-5 |
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For acid copper plating,decorative and functional availability coating(such as: printed circuit board).SPS,used as copper electroplating chemicals, copper electroplating intermediates,copper electroplating additives; copper plating chemicals,copper plating intermediates,copper plating additives,acid copper brightener,copper electroplating brightener,copper plating brightener. |
Type | ALS sodium allysulfonate 2495-39-8 |
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Usage: Assistant brightener in nickel bath. ALS, used as nickel electroplating chemicals, nickel electroplating intermediates, nickel electroplating additives; nickel plating chemicals, nickel plating intermediates, nickel plating additives,nickel electroplating brighteners,nickel plating brighteners. Characteristic: Primary brightener, to improve distribution capacity and ductility of metal. |